Huona (Shanghai) New Material Co., Ltd.
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Product Name: TO63-03A Hermetic Sealing Package
Model Number: TO63-03A
Package Type: TO-style metal can (Transistor Outline)
Sealing Technology: Glass-to-Metal Sealing (GTMS)
Materials:
Housing: Kovar alloy (Fe-Ni-Co) or stainless steel
Pins: Kovar, Dumet, or custom conductive materials
Insulation Medium: Borosilicate or high-insulation glass
Excellent hermeticity with leak rate ≤1×10⁻⁸ atm·cc/sec (helium leak test), suitable for aerospace, defense, and high-reliability applications
Wide temperature range from -55°C to +300°C for use in extreme environments
Strong mechanical structure with high resistance to vibration and shock
Effective thermal path through the TO-style metal base, ideal for power components and heat-sensitive devices
Full customization available: pin configuration, plating thickness, housing size, materials, etc.
| Item | Specification / Range |
|---|---|
| Housing Material | Kovar alloy or 304 stainless steel |
| Number of Pins | 3 pins (customizable to 4, 6,8 etc.) |
| Plating Options | Nickel, Gold (0.5–2μm thickness) |
| Glass Insulator | Borosilicate or high-insulation custom glass |
| Hermeticity | ≤1×10⁻⁸ atm·cc/sec (He leak test) |
| Operating Temp. | -55°C to +300°C |
| Surface Finish | Nickel plated, gold plated, or blackened |
| Dimensional Customization | Available upon customer drawings |
| Packaging | Vacuum sealed, anti-static bag, foam tray |
Laser diode and VCSEL packaging
Infrared sensor and detector modules
Power electronics: IGBT, MOSFET, and high-current transistors
RF and microwave device packaging
Medical sensor modules requiring hermetic enclosures
Aerospace, defense, and industrial electronics
2D/3D drawings in PDF or STEP format
Helium leak and material composition reports
RoHS and REACH compliance certificates
OEM/ODM customization available from prototype to volume
Technical consulting for packaging layout, sealing process, and thermal design
