Huona (Shanghai) New Material Co., Ltd.
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| Grade | TB20110 |
| High expansion layer | Mn75Ni15Cu10 |
| Low expansion layer | Ni36 |
| Grade | C | Si | Mn | P | S | Ni | Cr | Cu | Fe |
| Ni36 | ≤0.05 | ≤0.3 | ≤0.6 | ≤0.02 | ≤0.02 | 35~37 | - | - | Bal. |
| Grade | C | Si | Mn | P | S | Ni | Cr | Cu | Fe |
| Mn72Ni10Cu18 | ≤0.05 | ≤0.5 | Bal. | ≤0.02 | ≤0.02 | 9~11 | - | 17~19 | ≤0.8 |
| Density (g/cm3) | 7.7 |
| Electrical resistivity at 20ºC(ohm mm2/m) | 1.13 ±5% |
| Thermal conductivity, λ/ W/(m*ºC) | 6 |
| Elastic Modulus, E/ Gpa | 113~142 |
| Bending K / 10-6 ºC-1(20~135ºC) | 20.8 |
| Temperature bending rate F/(20~130ºC)10-6ºC-1 | 39.0%±5% |
| Allowable temperature (ºC) | -70~ 200 |
| Linear temperature (ºC) | -20~ 150 |
| Alloys Name | Type | Dimension | ||
| TB 20110 | Strip | W= 5~120mm | T= 0.1mm | |